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Soldering in Electronics Assembly, by MIKE JUDD, Keith Brindley
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Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly.
Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.
Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert UK, Director of Marketing Europe for Electrovert, part of the Cookson Group, and Director of OEM at Speedline.
Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology.
- A practical guide for the industry covering all the main soldering processes currently in use
- Cleaning, faults, troubleshooting and standards are all major topics
- Considers safety and solder process quality assessment
- Sales Rank: #3513741 in eBooks
- Published on: 1999-03-26
- Released on: 1999-03-26
- Format: Kindle eBook
Review
'This excellent book clearly explains soldering processes, solder, flux, cleaning and quality control, as they apply to printed circuit board assembly. [The book] deserves a place on the desk or bench of everyone involved in the practical business of modern machine soldering in electronics.'
ITRI Journal
From the Publisher
Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.
Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert UK, Director of Marketing Europe for Electrovert, part of the Cookson Group, and Director of OEM at Speedline.
Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology.
From the Back Cover
Soldering in Electronics Assembly is a unique survey of the state of the art in industrial contruction of electronics assemblies. the main techniques of industrial soldering are explored in terms of principles, best-practice, quality issues, fault-finding and troubleshooting. It is essential reading for managers, production engineersand technical professionals, and an invaluable guide to the subject for students of electrical engineering and professional trainees.
The second edition has been fully updated to cover the latest technical developments. A major addition is a photographic guide to defects, contributed by Bob Willis, a renowned trainer in this field.
Soldering in Electronics Assembly
* looks at soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements
* covers every available process, from hand soldering through to the latest developments, such as inert atmosphere wave soldering and zoned force convection reflow machines
* provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability; and soldering process defects and causes
* includes new sections on Ball Grid Array (BGA) technology and the hot opic of lead-free soldering
Most helpful customer reviews
4 of 6 people found the following review helpful.
A definitive work on production soldering
By John Boyle
Soldering in Electronics Assembly contains the broadest base of technology and materials related to all facets of electronic soldering. Our technical quality controls engineer here at The RSS Group has adopted the volume as the training and inspection standard for our assemblers and inspectors.
Any mechanical or design engineer needing a fine broad range technical information overview of the soldering processes 'must' have a copy of this work.
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